Dicing is an essential step in semiconductor manufacturing, where manufacturers cut silicon wafers into individual chips or dies. Traditionally, this process has relied on saw
Please tell us what you want to mark, the size and desired power and other information.
Yes, we will, English manual and video will come along with the machine.You also can contact our service team if you need any help during use our machines.
Delivery time is 20-30 days after receiving the deposit
You can make the payment to our bank account, Western Union or PayPal:30% deposit in advance, 70% balance against the copy of B/L.
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